RAMPS 25A Mainboard Expansion Module Heated Bed Control High Current Powerful MOSFET HA210NO6 For RAMPS 1.4 3D Printer Parts
Name:3D Printer High Power Hot Bed Module
Product weight: 65g
Size: 70*45*29mm /2.76* 1.77*0.87″
Max. Current: 25A (Enhance heat dissipation) safe for prolonged times. ensure active cooling of the heatsink.
Apply for:Anet A8
Distance between holes: 62.8*37.8mm/2.47 *1.49”
Supply/Operating Voltage:12V-50V (12-24VDC recommended)
Size of suitable fan:30mm*30mm
Package list: 1pc High Power Module;
2pc* 30cm power supply wires(one is red and the other one is black)
Hot bed high-power expansion module, compact appearance, unique snowflake heat sink appearance design, more powerful heat dissipation, solve the problem of excessive heat bed power and current load, this module under normal heat dissipation, measured I (Max) = 25A It can work stably for a long time, and the current should not exceed 25A during use.
